Principal Yield & Integration Engineer

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. ​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Job Summary:

Under the general supervision of the Yield & Integration Engineering Manager, the Principal Yield & Integration Engineer is a technical leader responsible for driving yield improvement, process integration robustness, and defectivity reduction across advanced IR detection and thermal imaging device manufacturing operations. This role provides deep expertise in yield analysis, failure analysis, and progressed materials characterization, while leading cross‑functional teams through complex yield excursion investigation, technology transfer, and new product introductions (NPI).

The individual will need to exhibit a self-driven sense of urgency, effective collaboration, tolerance of ambiguity, and demonstrated ability to exercise objective technical judgement while embracing the following responsibilities:

Yield Ownership & Defectivity Reduction Oversee wafer foundry yield management by establishing yield monitoring frameworks, analyzing inline, parametric, and final test data to identify yield loss mechanisms

Lead root cause investigations into yield excursions across fabrication, assembly, and test

Collaborate closely with foundry partners and internal process integration, device, and reliability teams to drive corrective actions, optimize process windows, and deliver sustained yield improvement and cost reduction

Advanced Failure Analysis & Characterization Analyze yield loss mechanisms impacting key detector metrics

Drive root cause analysis using advanced tools and techniques

Correlate physical defects to electrical, thermal, and optical performance impact

Process Integration – IR & Bolometer Technologies Own and optimize integrated process flows

Ensure compatibility and robustness across front-end, MEMS, and back-end processes

Support technology transfers and manufacturing ramp of new IR detector designs

Data Analytics & Performance Correlation Correlate process data with thermal imaging performance metrics and test results

Perform advanced yield and performance analysis using JMP, Python, SQL, or MATLAB

Develop yield dashboards, defect Pareto analyses, and predictive indicators for yield risk

Cross‑Functional Technical Leadership Partner closely with device design and modeling teams, ROIC and electronics engineering,

Interact reliability, packaging, and test engineering

Interface with equipment vendors, material suppliers, and external foundries on yield and integration issues

Support customer-facing root cause investigations and continuous improvement efforts

Mentorship & Continuous Improvement Mentor junior yield and integration engineers in IR-specific failure analysis and yield methodologies

Lead multi‑disciplinary improvement projects using Lean and Six Sigma tools

Define best practices, documentation standards, and yield control plans for manufacturing

The ideal candidate will have the following:

Technical Expertise Familiarity with electronic circuit functionality (schematics, functional elements, etc.)

Microbolometer MEMS fabrication

Insight to wafer foundry functionality and process integration

Vacuum technology: concepts, materials, and equipment

Familiarity with photolithography processes and equipment

ROIC-to-detector hybridization

Wafer bonding, dicing, and release steps

Strong understanding of MEMS processing, thin films, and wafer-level integration Photolithography

Wafer photo pattern strips & cleans

CMP, Etch, Lift-off

PECVD, PVD, E-Beam

Expertise in SPC, DOE, and yield analytics

Hands-on experience with AOI, SEM, EDX, FIB, FTIR

Skills Strong data-driven decision-making and mentorship capabilities

Exceptional root cause analysis and system-level thinking

Strong written and verbal communication

Ability to lead technically across organizations without direct authority

Required Qualifications

M.S. or equivalent in a STEM field- Will consider work equivalent work experience.

7+ years of experience in yield engineering, process integration, or device engineering

Direct experience with infrared detectors, thermal imaging systems, microbolometers, or MEMS devices

Must be US Citizen or PERM Resident

Preferred Qualifications

Familiarity with vacuum packaging, wafer bonding, and hermetic sealing

Prior ownership of an IR technology node or product family

Six Sigma Green Belt or Black Belt certification

Salary Range: $177,500.00-$236,600.000

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​