Principal Packaging Engineer

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 78596

Position Summary

Skyworks is seeking a Principal Packaging Engineer in Nashua, NH or Austin, TX, to support the RF and Mixed Signal Intelligence Business Unit. This role will provide package-engineering leadership for new product introduction and support package design, material selection, assembly readiness, qualification, and production release. The position spans SOIC, lead-frame, QFN, LGA, BGA, and WLCSP package technologies and requires close collaboration with R&D, device and process engineering, module design, program management, operations, internal assembly sites, and outsourced semiconductor assembly and test partners.

Key Responsibilities

Provide package-design support and material-selection guidance to enable high-yielding, reliable, and cost-effective products.

Develop and introduce new packaging technologies while supporting existing and legacy products.

Collaborate with cross-functional teams to confirm adherence to design and technology rules and to define technology choices, timelines, milestones, and deliverables for new product launches.

Lead end-to-end product readiness and the transition from development to production release, coordinating Design, Process, Test, Operations, and Module teams to meet quality, performance, and schedule objectives.

Work with Skyworks’ internal assembly operation in Mexicali and external OSAT partners across Asia to support assembly-site selection, qualification, and execution.

Lead product-readiness reviews covering technology, capability, capacity, and cost for each product release.

Conduct design, process, and technology risk assessments and coordinate reliability activities throughout technology development, NPI, and ramp-up to support Cpk and yield targets.

Identify risks and challenges in the NPI process and develop practical mitigation plans.

Collaborate openly with cross-functional teams to manage projects, resolve technical and operational problems, and address critical issues.

Prepare clear status reports and executive-level updates on product readiness, risks, decisions, and recovery actions.

Required Qualifications

Bachelor's degree in Mechanical Engineering or a related engineering discipline, with 10+ years of relevant semiconductor packaging experience.

Strong experience in new product introduction, package engineering, and package design for SOIC, QFN, lead-frame, LGA, BGA, and WLCSP semiconductor assemblies.

Hands-on knowledge of semiconductor packaging assembly processes, including solder attach, die attach, wire bonding, overmolding, material curing, and BGA assembly.

Experience applying relevant JEDEC, IATF, and AEC requirements to IC packaging and qualification.

Strong knowledge of electronic packaging technologies, structures, materials, and processes, including EDS, die-stacking, SiP, MCM, WLCSP, and dual-sided packages.

Experience with IC package modeling and simulation and with package-related failure analysis.

Strong understanding of product development, manufacturing processes, and supply-chain management.

Proven leadership, communication, and interpersonal skills, with the ability to work effectively in a multicultural and cross-functional environment.

Knowledge of project-management principles and practices.

Strong technical and interpersonal problem-solving and analytical skills.

Excellent written, verbal, and presentation skills.

Ability to work autonomously, stay organized, maintain attention to detail, and set high standards for execution.

Preferred Profile

The successful candidate would be a technically credible packaging leader who can connect package architecture and assembly-process decisions to product performance, reliability, cost, capacity, and schedule. The role requires disciplined execution, clear decision-making, and the ability to influence teams and suppliers without direct authority.

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The typical base pay range for this role across the U.S. is currently USD $122,900 - $255,200 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.