Senior Power Engineer

For 80 years, Murata Electronics has been a tireless innovator, committed to developing technologies that profoundly change the world around us. Our solutions are inside more state-of-the-art products than you may imagine. Additionally, we enable other global companies to turn their visions into reality – from mobile communications to computers and networking, medical devices to power solutions, smart home technologies to automotive electronics. Our past innovations drive today's technology – and our present innovations are shaping tomorrow's. Whatever the future holds, you can be sure that Murata will be a part of it. Why Consider This Job Opportunity The Senior Power Engineer leads technical marketing for next generation AI data center power delivery from PDB/IBC through package/on-die delivery networks. Work directly with customers and internal engineering teams to translate emerging system challenges into quantitative requirements, technology roadmaps and new R&D initiatives. Workplace Policy Hybrid from San Jose, CA. What To Expect (Essential Job Responsibilities) Analyze end to end AI server power delivery from rack/PDB and 48V IBC stages through multiphase VRs, PoL converters, and integrated regulators. Translate customer needs into quantitative electrical, thermal, mechanical including voltage, current efficiency, power density, transient response. Identify the system-level problem behind customer component specifications. Create and advance design-in, joint-evaluation, and co-development opportunities by connecting customer roadmaps with internal product and R&D capabilities. Serve as the technical interface among customers, sales, product divisions, corporate R&D, and external partners; proactively initiate communication to obtain required information and drive decisions. Miscellaneous Job Responsibilities Monitor emerging technologies and ecosystem changes, including 800 VDC rack distribution, vertical power delivery, TLVR, switched-capacitor and hybrid converters, IVR, backside power delivery, glass-core substrates, through-glass vias, embedded power components, and advanced cooling. Build relationships with universities, startups, semiconductor companies, packaging suppliers, and research institutes to identify collaboration and innovation opportunities. Support predominantly virtual collaboration with sales, technical support, and customer teams across Dallas, San Jose, and other U.S. and global locations; travel as required for customer and partner engagements. Perform other related duties and support cross-functional initiatives as assigned. This position is currently intended as an individual-contributor role with no direct supervisory responsibility unless otherwise assigned. What Is Required (Qualifications) Bachelor’s degree in electrical engineering, Power Electronics, Semiconductor Engineering, Electronic Packaging, or a closely related technical field. 5+ of relevant industry experience in power electronics, server/data center power architecture, board- or package-level PDN/power integrity, semiconductor power applications, power modules, magnetics, or passive components. Strong understanding of DC-DC power conversion, including buck and multiphase converters; working knowledge of IBC, POL, switched-capacitor, coupled-inductor, or related architectures. Working knowledge of target impedance, decoupling, voltage droop, transient response, and parasitic resistance and inductance across board and package interconnects. Ability to convert customer needs into measurable technical requirements, product specifications, technical proposals, or development plans. Strong communication and presentation skills with the ability to engage circuit designers, package engineers, system architects, commercial teams, and senior leadership. Ability to work independently, initiate cross-site communication, and lead projects across organizational and geographic boundaries. How To Stand Out (Preferred Qualifications) Master's degree or Ph.D. in Electrical Engineering, Power Electronics, Semiconductor Engineering, Electronic Packaging, or a related field. Experience with Hyperscalers, AI accelerator companies, server OEMs/ODMs, power solution suppliers, or advanced packaging organizations. Experience with 48 V/54 V power delivery, high-voltage DC distribution, TLVR, vertical power delivery, IVR, hybrid converters, or processors operating above 1 kW or at kiloampere-class current levels. Knowledge of advanced packages, interposers, glass-core substrates, TGV, embedded passives, backside power delivery, thermal design, or liquid cooling. Previous technical marketing, product management, field applications, new product definition, customer co-development, design-in, or design-win experience. Other Infrequent domestic and international travel. Minimum Salary: $97,894 Maximum Salary: $162,259 Perks Comprehensive benefits package including medical, dental, and vision insurance. Generous Paid Time Off including paid holidays and floating holidays. 401(k) employer match on retirement planning. Hybrid working schedule for eligible positions. Tuition reimbursement on approved programs. Flexible and health spending accounts. Talent Development program. Imagine the possibilities as a member of Murata's innovative global team. Be an innovator - Join Murata! Murata offers competitive compensation and comprehensive benefits. Equal Opportunity/Affirmative Action Employer - M/F/Disabilities/Veteran s