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About the job

Job Title: Specialist, Opto-Mechanical Engineer

Job Code: 43056

Job Location: Tulsa, OK (Aeromet) (On-Site)

Job Schedule: 9/80: Employees work 9 out of every 14 days- totaling 80 hours worked- and have every other Friday off

Job Description:

We are seeking a skilled and experienced Electro/Opto-Mechanical Engineer to lead and execute the design, integration, testing, and production support of complex electro-mechanical systems involving electronics packaging, sensor integration, optical systems packaging, and electro-optical mechanism design. This role is suited for a mid-level engineer who has developed a strong technical foundation and is ready to take greater ownership of hardware development efforts, contribute to cross-functional project execution, and begin mentoring junior team members.

The ideal candidate will work collaboratively across mechanical, electrical, optical, software, firmware, systems engineering and manufacturing teams to deliver tightly integrated solutions for advanced, high-reliability products and systems. Responsibilities include electro-mechanical system design and analysis, electronics and sensor packaging, optical systems packaging, electro/opto-mechanism design, CAD modeling, tolerance analysis, thermal and structural analysis, hardware bring-up, test fixture development, and design-for-manufacture-and-assembly (DFMA). This engineer is expected to work with increasing independence, drive technical decisions within their scope, and actively contribute to design reviews, project planning, and process improvement efforts.

Essential Functions:

Lead and execute the design and integration of electro-mechanical assemblies, including gear-trains, motors, adjustable mounts, flexures, and precision mechanisms for demanding operational environments including temperature extremes, shock, vibration, and contamination

Develop electronics packaging designs that account for thermal management, shock and vibration, EMI/EMC constraints, signal integrity, manufacturability, and long-term reliability

Lead sensor packaging and integration efforts, including physical layout, interface definition, keep-in/keep-out volume management, connector and harness routing, and interface coordination with electrical, optical and systems engineering teams

Design and integrate optical systems packaging, including opto-mechanical mounts, lens assemblies, detector housings, alignment features, and precision positioning hardware for electro-optical systems

Develop electro-optical mechanism designs, including gimballed systems, scanning mechanisms, focus assemblies, and precision positioning hardware, with demonstrated understanding of performance, alignment, and environmental requirements

Perform and interpret structural, modal, thermal, and fluid flow analyses using FEA and CFD tools to validate designs, resolve technical issues, and support hardware decisions

Create and maintain CAD models, assemblies, and fabrication drawings in accordance with engineering standards, GD&T practices, and program-specific requirements

Drive prototype fabrication, hardware bring-up, assembly procedures, and manufacturing build support with increasing ownership and accountability

Design and develop test equipment, validation fixtures, and production support tooling

Lead or support hardware testing, data collection and analysis, failure analysis, and root cause investigations, and implement corrective actions

Partner closely with electrical, optical, system, software, and manufacturing engineers to manage packaging constraints, interface definitions, and total system integration

Contribute to design reviews, cost and schedule estimation, risk identification, and technical documentation

Begin providing technical guidance and mentorship to junior engineers

Apply and champion AI-enabled workflow improvements while adhering to responsible and ethical AI practices

4–6 years of relevant experience in mechanical design, electro-mechanical systems, electronics packaging, optical systems packaging, or product development; or a Graduate Degree with a minimum of 2-4 years of prior related experience

Demonstrated hands-on experience with electro-mechanical assembly design, including mechanisms, motors, gear-trains, mounts, and flexures for harsh or precision environments

Experience with electronics packaging design, including thermal, structural, and environmental considerations

Experience with sensor packaging and integration, including interface coordination across mechanical, electrical, and optical disciplines

Proficiency in CAD tools such as Siemens NX, including part modeling, assembly design, drawing creation, and Teamcenter PLM workflows

Experience performing structural, thermal, vibration, or fluid flow analyses using FEA and CFD tools such as Ansys, FEMAP or SolidWorks Simulation

Demonstrated ability to work independently on hardware development tasks across the full engineering lifecycle, from concept through production

Experience with prototype fabrication, hardware bring-up, assembly procedures, and manufacturing support

Strong communication, organizational, and problem-solving skills with the ability to engage effectively across engineering disciplines

Proficiency in common engineering and business tools such as Excel, Word, and PowerPoint

Qualifications:

Bachelor’s Degree and minimum 4 years of prior relevant experience. Graduate Degree and a minimum of 2 years of prior related experience. In lieu of a degree, minimum of 8 years of prior related experience.

Preferred Additional Skills:

Experience with optical systems packaging, opto-mechanical design, or electro-optical mechanism design, including gimballed or scanning systems

Familiarity with electronics packaging for harsh environments, including thermal gradient control, vibration isolation, and environmental sealing strategies

Experience with motion control systems, including motors, gear-trains, encoders, and precision positioning mechanisms, including application-level integration and troubleshooting

Experience with test equipment design and fabrication, hardware verification, and production test support

Demonstrated experience with tolerance analysis, GD&T, interface definition, GD&T, and engineering drawing interpretation and creation

Familiarity with manufacturing operations, assembly processes, DFMA principles, and production flow

Experience with PLM systems such as Siemens Teamcenter or similar engineering data management platforms

Proficiency in scripting or programming tools such as Python, MATLAB, or VBA for engineering analysis, data reduction, or workflow automation

Experience in robotics, consumer electronics, aerospace, defense, electro-mechanics, opto-mechanics or high-reliability hardware development

Exposure to cost and schedule estimation, project planning, and participation in formal design reviews

Experience providing technical guidance or informal mentorship to junior engineers or technicians

Familiarity with SAP or similar enterprise resource planning and engineering database systems

Demonstrated use of AI tools to improve engineering workflows, efficiency, and quality

Ongoing AI skill development and experience implementing responsible, ethical AI practices

An active Secret or Top Secret US DoD clearance or the ability to obtain a US DoD clearance

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