Package Development Engineer
AMI Semiconductor
Scottsdale, AZ · Posted September 15, 2026
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Where Scottsdale, AZ ranks
Where Scottsdale, AZ placed in our monthly rankings, month by month. Each month stays online at its own address.
November 2026
- #3Best all-round cities for new graduates in the Southwest59 / 100 · of 15
- #4Cities with the most hybrid jobs in the Southwest16% · of 43
- #7Cities hosting the most business conferences in the Southwest13 conferences · of 16
- #8Best cities for entry-level jobs that want AI skills in the Southwest7% · of 39
- #8Best all-round cities for AI careers in the Southwest44 / 100 · of 15
- #9Cities with the most jobs that do not need a four-year degree in the Southwest81 jobs · of 38
Rankings about engineering jobs
- Best cities for software and engineering jobs #1 San Francisco (3,412 openings)
- Best cities for engineering pay after cost of living #1 San Mateo ($216k)
- Most requested AI skills in engineering jobs #1 AI tools in daily work (6.1%)
- AI tools named most often in engineering jobs #1 Claude (1.7%)
- Employers with the most engineering jobs #1 Amazon (2,992 roles)
How AI is used in this kind of work
AI use among chemical engineers is little observed so far. Measured exposure for chemical engineers: 0% (little observed).
Share of this job’s tasks that AI is already used for at work, from real usage. It is not a forecast of job loss, and a low number means no use seen yet. Source: Anthropic Economic Index.
About the job
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package architecture, material selection, process development, reliability qualification, and manufacturing readiness while collaborating with internal and external partners throughout the product development lifecycle.
Develop embedded package architectures with embedded passives, active devices, and HDI substrates.
Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules.
Lead process development for embedding, lamination, laser drilling, metallization, and assembly.
Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements.
Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions.
Conduct root cause analysis and implement yield, quality, and cost improvements.
Lead cross-functional teams through concept, development, qualification, and production release.
BS/MS in Electrical, Mechanical, Materials, Chemical Engineering, or related field.
8+ years of semiconductor package development experience.
Proven expertise in embedded packaging, substrate technologies, and advanced interconnects.
Strong knowledge of package reliability, failure analysis, and manufacturing processes.
Experience with DOE, statistical analysis, and process optimization.
Experience working with OSATs, substrate suppliers, and material vendors.
Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
Proven ability to lead projects across organizations and cultures in a fast-paced environment.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits