Senior Staff Engineer / Principle Engineer (SON Package)

#WeAreIn for jobs that impact everyone's life.

Optimize. Innovate. Deliver. Join us in redefining manufacturing excellence.

As a Senior Staff / Principle Engineer Molding / Mark, Trim & Form / Die Attach / Clip Attach / Final Test, Scan & Pack (SON Package) in our Manufacturing and Operations team, find yourself in a high-tech world where silicon wafers evolve into cutting-edge products. In our advanced cleanroom environment, every detail count, and your expertise will help shape the future, one innovation at a time.

Are you in?

Your role Key responsibilities in your new role

Lead engineering activities for Molding / Mark, Trim & Form / Die Attach and Clip Attach / Final Test, Scan and Packing processes for SON product

Drive process optimization to improve test yield, quality, productivity, equipment utilization, and manufacturing cost

Lead process & equipment qualification and process characterization.

Your profile Qualifications and skills to help you succeed

· Bachelor's Degree, Master’s degree or PhD in Engineering (Electrical, Electronics, Mechanical, Materials, Manufacturing, Physics, Computer or related discipline)

· Minimum10 years of semiconductor manufacturing experience, with significant exposure to:

o Mold : Transfer Molding processes, BESI, ASM and Asahi equipment.

o Mark, Trim & Form : Marking Processes , Trim & Form operations , BESI and ASM equipment, TDSON or similar leadframe-based packages.

o Die Attach / Clip Attach : Die Attach process or similar leadframe packages, Clip Attach Technology , Solder Paste and reflow processes , ASM Die Bonder platforms , Knowledge of leadframe-based power package assembly processes .

o Final Test, Scan and Pack : Final Test operations, ETS88 Test Systems , SRM (Scan and Reel Module) processes, ExisTech Handler platforms.

· Preferred Qualifications

o Die Attach / Clip Attach

- Expertise in ASM AD series Die Bonders or equivalent platforms

- Experience with solder paste, clip attach, and power package assembly technologies

- Familiarity with TDSON, STOLL or similar leadframe-based packages .

o Final Test, Scan and Pack

- Experience with ETS88 test platform development, optimization, and troubleshooting

- Strong knowledge of handler-test cell integration and automation systems .

· Strong troubleshooting and problem-solving skills

· Excellent communication , leadership , and project management capabilities

· Ability to work effectively in a cross-functional and multinational environment .

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

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