Sr Principal Sourcing Manager – Silicon Technologies

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com .

Role Overview

Astera Labs is seeking a highly experienced Sr. Principal – Technical Category Sourcing Manager – OSAT & Substrate to set and drive global sourcing strategy in partnership with Engineering—owning supplier selection, commercial negotiations, and product cost models across our outsourced semiconductor assembly and test (OSAT), advanced packaging, and package substrate supply base.

This role owns the end-to-end commercial relationship with OSAT partners, substrate suppliers, and their sub-tier raw material sources—from sourcing strategy and RFQ through pricing, contracting, capacity assurance, and cost roadmaps—across advanced packaging platforms including flip-chip BGA, 2.5D/3D integration, chiplet-based multi-chip packages, and high-layer-count ABF substrates.

This is a highly cross-functional role working closely with Package Engineering, Test Engineering, Operations, Quality, Finance, and Legal to secure capacity, qualify new suppliers, and deliver cost and supply-continuity commitments through NPI and high-volume production.

A core focus of this role is staying ahead of the technology pipeline: as our silicon moves to advanced process nodes and increasingly complex multi-chip packages, you will secure the assembly, test, and substrate capability—and the sub-tier raw materials behind it—well before those platforms reach production.

Success in this role requires a strong balance of technical acumen, business savvy, and the ability to execute against strategic objectives—translating engineering requirements into sourcing decisions, and sourcing strategy into measurable cost, capacity, and continuity outcomes.

A Day in the Life

In this role, you will:

Set and drive global sourcing strategy for OSAT, advanced packaging, and substrates in partnership with Engineering

Lead RFQs, pricing negotiations, and commercial agreements with OSAT and substrate partners

Secure capacity, tooling, and NRE commitments ahead of demand inflection points

Build and maintain product cost models and defend annual cost-reduction roadmaps

Qualify and develop second-source suppliers to de-risk single-source packages

Partner with Package and Test Engineering to source emerging advanced packaging and multi-chip package technologies

Map the advanced packaging and advanced process node roadmap to supplier capability and capacity gaps

Engage sub-tier substrate suppliers to secure ABF film, copper foil, and other critical raw materials

Negotiate LTAs, capacity reservation agreements, and pricing structures alongside Legal and Finance

Drive supplier business reviews, scorecards, and escalation of commercial and supply issues

Key Responsibilities

Category Strategy & Supplier Selection

Set and drive the global sourcing strategy for OSAT services (assembly, test) and package substrates (ABF, BT, organic interposer) in partnership with Package and Test Engineering

Build alignment with Engineering, Operations, and Finance on category strategy and execute against multi-year strategic objectives

Segment the supply base and define single-, dual-, and multi-source strategies by package family and technology node

Lead supplier selection, RFI/RFQ, and award decisions in partnership with Package and Test Engineering

Benchmark the OSAT and substrate landscape, tracking technology roadmaps, capacity additions, and regional footprint

Advanced Packaging & Emerging Technology Sourcing

Partner with Package Engineering to source emerging advanced packaging platforms, including 2.5D/3D integration, chiplet-based multi-chip packages, and high-density organic and silicon interposers

Translate the product roadmap at advanced process nodes into assembly, test, and substrate capability requirements and sourcing plans

Identify and qualify suppliers with the technology roadmap, equipment, and capacity to support next-generation package architectures

Negotiate development, prototype, and qualification terms for pre-production advanced packaging technologies, including NRE, tooling, and test development

Commercial Negotiation & Contracting

Lead pricing, tooling, NRE, and capacity negotiations with OSAT and substrate suppliers

Negotiate and manage MSAs, LTAs, capacity reservation agreements, and pricing addenda with Legal and Finance

Structure commercial terms covering yield, scrap, material liability, lead time, and cost-down commitments

Serve as the primary commercial point of contact and escalation path for assigned suppliers

Product Cost Modeling & Cost Management

Build and maintain product cost models spanning substrate, assembly, test, and yield, and keep them current as designs, nodes, and supplier pricing evolve

Maintain should-cost and total-cost-of-ownership models for assembly, test, and substrate to benchmark supplier quotes and award decisions

Develop and deliver annual cost-reduction roadmaps tied to yield, test time, panel utilization, and design-for-cost initiatives

Partner with Finance on standard cost, purchase price variance, cost forecasting, and budget planning

Drive cost transparency across substrate layer count, body size, test insertions, and key material inputs

Capacity Assurance & Supply Continuity

Secure assembly, test, and substrate capacity aligned to product roadmaps and long-range demand

Negotiate capacity corridors, pre-buys, and tooling investments ahead of ramp

Establish continuity and dual-source plans for single-source packages and long-lead substrates

Partner with Planning on allocation decisions and recovery plans during constrained supply

Sub-Tier & Raw Material Security

Map the substrate supply chain to its sub-tier sources, including ABF film, copper-clad laminate, copper foil, prepreg, and carrier materials

Engage directly with sub-tier material suppliers to secure allocation, lead times, and reserved capacity for constrained raw materials

Track sub-tier capacity expansions, qualification status, and single-source exposure across the substrate value chain

Build raw material continuity plans—buffer stock, pre-buys, and alternate material qualification—with substrate suppliers and Package Engineering

Supplier Performance & Development

Own supplier scorecards and quarterly business reviews covering cost, delivery, quality, and responsiveness

Drive corrective action and continuous improvement with Quality and Engineering on supplier issues

Develop emerging OSAT and substrate suppliers to expand qualified capacity and technology options

Manage supplier risk including financial health, geographic concentration, and sub-tier material exposure

NPI & Cross-Functional Partnership

Engage early in NPI to influence package and test architecture decisions for cost and sourceability

Secure prototype, qualification, and ramp capacity and commercial terms for new products

Partner with Package Engineering, Test Engineering, Operations, and Quality on supplier qualification plans

Align with Product and Finance on cost targets, margin impact, and sourcing assumptions for new programs

Basic Qualifications

Bachelor’s degree in Engineering, Supply Chain, Business, or related field

12+ years of experience in strategic sourcing, procurement, or supplier management within semiconductor, OSAT, or electronics manufacturing

Direct category experience sourcing OSAT services (assembly, test) and/or package substrates

Deep working knowledge of advanced packaging technologies (e.g., flip-chip BGA, 2.5D/3D integration, chiplet-based multi-chip packages, high-layer-count ABF substrates) and wafer sort/final test flows

Experience managing sub-tier (n-tier) suppliers and securing constrained raw materials such as ABF film, copper-clad laminate, and copper foil

Experience sourcing for products at advanced process nodes and for new package architectures ahead of production release

Proven track record negotiating complex commercial agreements (LTAs, capacity reservations, pricing, NRE/tooling) with Asia-based suppliers

Proven ability to build and maintain product cost models, should-cost analyses, and total-cost-of-ownership models

Demonstrated balance of technical acumen and business judgment, with a track record of executing against multi-year strategic objectives

Experience with ERP and procurement systems (e.g., SAP, Oracle, NetSuite) and sourcing processes (RFQ, award, supplier qualification)

Excellent cross-functional communication and executive-level stakeholder management skills

Preferred Qualifications

Advanced degree (MBA or MS in Engineering, Supply Chain, or Business)

Experience in AI infrastructure, cloud hardware, or high-speed interconnect ecosystems

Established relationships across the OSAT and substrate supplier base in Taiwan, Korea, Japan, China, and Southeast Asia

Experience standing up new suppliers and qualifying second sources in a high-growth fabless environment

Familiarity with advanced packaging cost drivers, substrate panel economics, and test-time reduction levers

Exposure to emerging packaging platforms such as panel-level packaging, glass substrates, or co-packaged optics

Why Join Us?

Own the OSAT, advanced packaging, and substrate category for mission-critical AI infrastructure silicon

Play a central role in scaling the back-end supply base during a period of hyper growth

Set the sourcing strategy for next-generation multi-chip packages alongside engineering, product, and operations leaders

Operate in a fast-paced environment with high impact on cost, margin, and supply continuity

Competitive compensation, equity, and benefits

Base salary range is $190,000 to $240,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.