Technical Support Engineer (Package Substrate)

Technical Support Engineer (Package Substrate) Job Title: Technical Support Engineer (Package Substrate) Our Client: A Leading Innovative Technologies Company Country: United States Location: Cupertino, CA Specialisation: Manufacturing & Engineering Salary: $100,000-$200,000 Job Reference: 16422 Contact Person: Leah SHI Managing Consultant Contact Email: leah.shi@cesna.com Job Published: 2026-10-29 Position Technical Support Engineer (Package Substrate) About Our Client Job Summary Serve as the on-site technical lead for advanced package substrate programs with Apple in the U.S., driving issue resolution and alignment with our teams in Korea to deliver successful mass production launches. Job Description 1) Main Responsibilities - Provide technical support for customer development programs (Mobile AiP, SiP, FC-CSP, RF). - Resolve technical issues and drive performance stabilization at the customer. - Identify and develop PoC opportunities through customer engagement. - Guide BOM and substrate structure selection using LGIT technical solutions. - Lead design reviews, TRA assessments, yield improvement, and production readiness. - Coordinate between customer engineering and LGIT R&D, Process, Quality, and Manufacturing. 2) Others - Conduct regular customer meetings and technical presentations. - Collect customer VOC and market intelligence to shape technology roadmaps. - Support technology promotions, exhibitions, and strategic customer engagements. - Promote advanced substrate technologies (Hybrid Stack-up, Fine Pattern, Cavity, Hyper Flex). Qualifications - Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field. - Bilingual in both English and Korean - - 10+ years in package substrate development, process or customer engineering, or technical marketing. - Proven record of leading substrate projects through mass production. - Experience supporting major semiconductor customers preferred. - Deep knowledge of substrate processes, materials, structures, and design rules. - Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, and RF. - Ability to translate customer requirements into technical solutions. - Experience in NPI, yield improvement, and production transfer. - Strong customer relationship management skills. - Clear technical presentation and communication skills. - Project management and problem-solving capability. - MS Office (PowerPoint, Excel, Word). - Six Sigma Green Belt or equivalent preferred. - PMP or equivalent project management certification preferred. Travel: - On-site customer support with frequent customer engagement. - Frequent travel to customer sites within the U.S. - Periodic travel to Korea for engineering and business reviews. What's On Offer Apply online or feel free to contact us directly for more information about the opportunity. Due to the high volume of applicant, we regret to inform that only shortlisted candidates will be notified. Thank you for your understanding. Apply Now Contact Leah Shi +1 201 567 8886 leah.shi@cesna.com Apply Now Request a call back Welcome to Cesna! Please fill in the form and request for a call back. By signing up you agree to receive the latest jobs available, salary reports, career advice, insights and industry updates, events and relevant surveys from us. By signing up to Cesna Group you are agreeing to our Standard Terms and Conditions and consenting to Cesna Group processing your personal details in relation to potential job vacancies. Your details will be processed in accordance with the Privacy Policy. Cesna Group terms and conditions apply.