Staff Application Engineer – STA / Signoff
Synopsys
Austin, TX · Posted May 19, 2026
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AI use among mechanical engineers is little observed so far. Measured exposure for mechanical engineers: 8% (little observed).
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Synopsys has filed one layoff notice in the last twelve months, covering 128 workers, most recently August 2026. These are public filings with state labor departments, and an open role can sit alongside them. See the filings
About the job
We Are: Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate next-generation semiconductor products. We deliver industry-leading design, verification, and signoff solutions that power the world’s most advanced chips. Working at the forefront of advanced nodes and complex SoCs, we partner with leading semiconductor companies to solve their toughest design challenges and accelerate time-to-market.
You Are:
You are a technically strong engineer who understands the critical importance of signoff in the chip design lifecycle. You are comfortable working at the intersection of tools, customers, and complex design challenges, and you thrive in solving real-world engineering problems. Whether it’s timing closure, power integrity, or reliability at advanced nodes, you bring a hands-on, analytical approach to debugging and delivering solutions.
You enjoy working directly with customers, understanding their challenges, and turning those into actionable solutions. You are proactive, able to take ownership of issues, and confident navigating ambiguity in fast-moving, customer-driven environments. You are also motivated to grow into a leadership role, guiding projects and influencing technical direction.
What You’ll Be Doing:
Support deployment and adoption of Synopsys signoff solutions across leading semiconductor companies and foundries
Engage directly with global customers, IP providers, and partners to understand and solve complex SoC and 3DIC design challenges
Provide hands-on technical support for static timing analysis (STA), power integrity (PDN/EMIR), signal integrity, and reliability signoff
Work closely with customers throughout both pre-sales and post-sales phases, including deployment, debugging, and optimization
Troubleshoot and resolve issues related to tools such as PrimeTime, RedHawk-SC (RHSC), PrimeClosure, PTECO, and Tweaker
Deploy and support the Synopsys Seascape platform and contribute to its adoption as a next-generation design platform
Collaborate with internal product engineering teams to influence product improvements based on real customer feedback
Own customer issues end-to-end, ensuring timely resolution and high customer satisfaction
Develop best practices, knowledge base content, and reusable solutions for internal and external stakeholders
Contribute to internal initiatives, knowledge sharing, and continuous improvement across the organization
The Impact You Will Have:
Enable successful deployment of Synopsys signoff solutions at top-tier semiconductor companies
Help customers resolve complex timing, power, and reliability challenges, accelerating their tape-out cycles
Influence the evolution of industry-leading EDA products through direct customer feedback
Strengthen customer relationships by acting as a trusted technical advisor
Improve internal capability through knowledge sharing and best practice development
Support business growth by enabling technical success in pre-sales and post-sales engagements
Drive innovation within the signoff domain, supporting next-generation chip development
What You’ll Need:
5+ years of experience in semiconductor design, with strong expertise in STA, timing closure, ECO, or PDN/EMIR at block or SoC level
Hands-on experience with tools such as PrimeTime, RHSC (RedHawk-SC), PrimeClosure, PTECO, or Tweaker
Strong understanding of signoff flows, timing analysis, power integrity, and reliability
Experience supporting customers or working in application engineering, customer engineering, or similar roles
Ability to debug and solve complex design issues independently
Strong problem-solving and analytical skills
Programming/scripting skills to automate workflows and solve engineering challenges
Knowledge of advanced node design and semiconductor flows is highly desirable
Who You Are:
You are comfortable working in a customer-facing environment, balancing multiple priorities and stakeholders
You take ownership of problems and drive them through to resolution
You are proactive, curious, and able to learn quickly in a fast-paced domain
You can explain complex technical concepts clearly to both technical and non-technical audiences
You collaborate effectively across teams and contribute to a strong team culture
You are motivated to grow into a technical leader, owning projects and guiding others
The Team You’ll Be Part Of:
You will join a growing Signoff Application Engineering team, supporting advanced semiconductor design across multiple customers and domains. The team works closely with product development and customers to solve critical design challenges in timing, power, and reliability. With increasing demand driven by advanced nodes and complex SoCs, the team plays a key role in ensuring successful chip delivery and customer success.
Rewards and Benefits:
We offer a comprehensive range of health, wellness, and financial benefits to support your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about salary range and benefits during the hiring process.If you are a visionary professional passionate about platform engineering and AI and are looking to make a significant impact in the semiconductor space, we encourage you to apply for this exciting opportunity in North America.