Senior PCB Designer
Viasat
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Tempe, AZ · Posted July 24, 2026
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Where Tempe, AZ ranks
Where Tempe, AZ placed in our monthly rankings, month by month. Each month stays online at its own address.
November 2026
- #5Cities with the most hybrid jobs in the Southwest14% · of 43
- #6Best all-round cities for new graduates in the Southwest55 / 100 · of 15
- #7Best cities for entry-level jobs that want AI skills in the Southwest8% · of 39
- #7Best all-round cities for AI careers in the Southwest54 / 100 · of 15
- #9Best college towns for junior jobs in the Southwest35% · of 32
- #9Best cities for AI-skill jobs in the Southwest11% · of 44
Rankings about design jobs
- Best cities for design jobs #1 New York (717 openings)
- Most requested AI skills in design jobs #1 AI tools in daily work (14.5%)
- Employers with the most design jobs #1 Amazon (176 roles)
How AI is used in this kind of work
AI use among electrical and electronics drafters is little observed so far. Measured exposure for electrical and electronics drafters: 9% (little observed).
Share of this job’s tasks that AI is already used for at work, from real usage. It is not a forecast of job loss, and a low number means no use seen yet. Source: Anthropic Economic Index.
About the job
About us
At Viasat, the work you do helps people stay connected in ways that matter, from everyday moments to critical missions across air, land, sea, and space.
We’re a place for people who are curious, bold, and motivated by meaningful work. Here, you'll have the opportunity to make an impact, explore new possibilities, and grow your career in ways that align with your interests and goals. When you're ready to take on something new, you'll find leaders who support your development and help you turn your ambition into action.
What you'll do
As a Senior PCB Designer on the Space Infrastructure team, you will design and deliver complex, high‑reliability printed circuit boards that enable next‑generation space systems and ground infrastructure. Daily tasks will involve utilizing Mentor Graphics Xpedition layout tools, including CES, to complete your designs. Your design work will follow IPC standards, as well as company and contract manufacturer DFx guidelines. You will own PCB layout from early architectural trade studies through fabrication release, working closely with hardware, mechanical, manufacturing, and test engineers to translate demanding system requirements into robust, manufacturable designs.
This role focuses on multi‑layer, high‑speed, mixed‑signal, and power‑dense boards that operate in challenging environments and support fast development cycles. You will help set design standards, improve workflows, and raise the overall quality and efficiency of PCB development across the organization.
This is a site‑based role, employees work 3+ days (60%+) per week from a Viasat office or work location within a standard five‑day workweek.
The day-to-day
Produce PCB layouts utilizing Mentor Graphics Xpedition.
Own PCB layout for complex designs, including component placement, routing, stack‑up definition, and constraint management for digital, analog, RF, and power circuits
Design and route high‑layer‑count boards (10+ layers) with controlled impedance, differential pairs, length matching, power integrity, and signal integrity considerations
Collaborate closely with electrical, mechanical, RF, thermal, manufacturing, and test engineers during schematic development and design reviews
Perform pre‑ and post‑layout SI/PI analysis, EMI/EMC risk mitigation, and layout trade studies to de‑risk designs early
Generate and release complete fabrication and assembly deliverables (Gerber, ODB++, IPC‑2581, drill files, stack‑ups, drawings, and assembly outputs)
Apply DFM/DFA/DFT best practices, incorporating feedback from fabrication and assembly partners to improve yield, cost, and schedule
Create, validate, and maintain symbols, footprints, and 3D models, and work with libraries to ensure accuracy and reuse
Support prototype bring‑up, debug, and iteration by working alongside hardware and test teams
Help define and improve PCB design standards, constraints, and workflows across the Space Infrastructure organization
Mentor junior designers and contribute to raising the technical bar for layout quality and execution speed
What you'll need
Associate's degree in electrical engineering or equivalent professional experience
5 - 8 years of professional PCB layout experience, including ownership of complex, multilayer designs
5+ years of direct experience using Mentor Xpedition and CES.
Schematic capture experience.
Demonstrated experience with high‑speed digital, mixed‑signal, and power electronics layouts
Strong understanding of signal integrity, power integrity, EMI/EMC, and manufacturability
Experience producing fabrication and assembly packages and working directly with board houses and assemblers
Ability to visualize component placement, routing strategies, and mechanical integration early in the design process
Strong communication skills and comfort working in fast‑paced, cross‑functional engineering environments
Ability to travel up to 10%
US Citizenship required
What will help you on the job
Bachelor’s degree in any engineering discipline.
Multi-layer Flex and Rigid-flex circuits experience.
Complex Multi-layer PWB utilizing high-speed materials, featuring microstrip, strip line, and differential routing, controlled impedance, mix of low-noise RF/analog circuitry.
Digital designs with various pin counts and fine-pitch BGAs, RF transmission lines, matched lengths, and delay control lengths.
Experience with JTAG, RGMI, DSP, DDR, LVDS, SERDES, and Ethernet design.
RF layout development with partitioning of circuits utilizing shields, specific mounting, and grounding requirements. All design criteria defined by engineering specifications.
Knowledgeable with hierarchical schematics and layout reuse schemes is a plus.
Familiarity with SI/PI simulation tools, constraint‑driven design, and automation or scripting
Experience supporting rapid development cycles, prototype iteration, and production ramp‑up
Exposure to space, aerospace, automotive, or other high‑reliability hardware environments
A practical, detail‑oriented mindset with a bias toward clean layouts, fast iteration, and manufacturable solutions
#LI-GS1
Salary range
$99,500.00 - $157,000.00 / annually. For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $123,500.00- $185,500.00/ annually
At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience. Base pay may vary depending on job-related knowledge, skills, and experience. Additional cash or stock incentives may be provided as part of the compensation package, in addition to a range of medical, financial, and/or other benefits, dependent on the position offered. Learn more about Viasat’s comprehensive benefit offerings that are focused on your holistic health and wellness at https://careers.viasat.com/benefits. EEO Statement
Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here .
Produce PCB layouts utilizing Mentor Graphics Xpedition.
Own PCB layout for complex designs, including component placement, routing, stack‑up definition, and constraint management for digital, analog, RF, and power circuits
Design and route high‑layer‑count boards (10+ layers) with controlled impedance, differential pairs, length matching, power integrity, and signal integrity considerations
Collaborate closely with electrical, mechanical, RF, thermal, manufacturing, and test engineers during schematic development and design reviews
Perform pre‑ and post‑layout SI/PI analysis, EMI/EMC risk mitigation, and layout trade studies to de‑risk designs early
Generate and release complete fabrication and assembly deliverables (Gerber, ODB++, IPC‑2581, drill files, stack‑ups, drawings, and assembly outputs)
Apply DFM/DFA/DFT best practices, incorporating feedback from fabrication and assembly partners to improve yield, cost, and schedule
Create, validate, and maintain symbols, footprints, and 3D models, and work with libraries to ensure accuracy and reuse
Support prototype bring‑up, debug, and iteration by working alongside hardware and test teams
Help define and improve PCB design standards, constraints, and workflows across the Space Infrastructure organization
Mentor junior designers and contribute to raising the technical bar for layout quality and execution speed
Associate's degree in electrical engineering or equivalent professional experience
5 - 8 years of professional PCB layout experience, including ownership of complex, multilayer designs
5+ years of direct experience using Mentor Xpedition and CES.
Schematic capture experience.
Demonstrated experience with high‑speed digital, mixed‑signal, and power electronics layouts
Strong understanding of signal integrity, power integrity, EMI/EMC, and manufacturability
Experience producing fabrication and assembly packages and working directly with board houses and assemblers
Ability to visualize component placement, routing strategies, and mechanical integration early in the design process
Strong communication skills and comfort working in fast‑paced, cross‑functional engineering environments
Ability to travel up to 10%
US Citizenship required